Laser cutting
Board Cutting Machine
- TypeFiber laser
- Kerf0.05–0.15 mm
GE-LCB6080 — cuts copper / aluminum PCB with no mechanical stress or burr. View specs →
Home/PCB Equipment
PCB production equipment by process flow
The complete chain of PCB machines, grouped in the order a board moves through the shop — cutting and drilling, plating, image transfer, etching, solder mask, surface finish and final test — for single, double-sided and multilayer boards and FPC.
GE builds equipment for every stage of PCB fabrication. Below, the machines are organised by process flow — the real sequence of a production line — so you can see which unit does each job and configure a turnkey line end to end. Our horizontal spray PCB etching machines run both ferric chloride (FeCl₃) and regenerable cupric chloride (CuCl₂) chemistries, with conveyor speed and spray pressure tuned for even, repeatable copper etching across the whole panel.
The PCB Process
Equipment by process flow
From laminate to tested board — tap a step to jump to the machines used in that stage.
Step 1 · Cutting & Drilling
Board cutting, drilling & routing
Cut the copper-clad laminate to size and make every hole — laser cutting leaves no stress or burr, CNC routers drill and profile, and the target driller sets multilayer registration.
CNC
CNC Drilling & Routing Machine
- Spindles2 / 3 / 4 / 6
- FunctionDrill + rout
Multi-spindle CNC for through-holes and board-outline profiling.
Target drill
Target Drilling Machine
- UseLayer registration
- ModeAuto / semi-auto
Drills tooling / target holes for accurate multilayer layer-to-layer alignment.
Step 2 · Deburring & Pre-treatment
Deburr, brush & clean
After drilling, the panel is deburred, brushed and washed so the copper is clean and slightly roughened — the condition dry film and plating need to adhere.
Deburring
Deburring / Brushing / Cleaning Machine
- ProcessBrush + deburr + wash
- Best forPost-drill prep
Removes drill burrs and conditions the copper surface for resist and plating adhesion.
Step 3 · Hole Metallization & Plating
PTH & copper plating
Drilled holes are chemically metallized, then copper is electroplated onto the holes and tracks so double-sided and multilayer boards conduct through the board.
PTH
PTH & Copper Plating Line
- ProcessPTH + electroplate
- Best forDouble / multilayer
Electroless copper through-hole metallization plus copper electroplating on holes and pattern.
Step 4 · Image Transfer
Coat, expose & develop
Transfer the circuit (and later the solder-mask) pattern: apply resist, expose the artwork, and develop to reveal the copper that will be etched. See the full exposure machine range.
Resist coating
Photoresist Coating / Dry-Film Laminator
- ResistDry film / liquid
- FunctionApply resist
Laminates dry film or coats liquid photoresist evenly before exposure.
Exposure
Exposure Machine
- LightUV / UV-LED / LDI
- Models8 in range
Single / double-side, 4-CCD / 8-CCD and LDI — open the full exposure range. View specs →
Developing
Developing Machine
- ProcessSpray develop
- ChemistryNa₂CO₃
Develops the exposed resist to reveal the copper pattern ahead of etching.
Step 5 · Etching & Stripping
Etch the copper, regenerate, strip
The core step — the etching machine dissolves the bare copper to leave the circuit, the regeneration system keeps the etchant at constant strength, and the stripper removes the resist.
Etching
Etching Machine
- EtchantFeCl₃ / CuCl₂
- TypeHorizontal spray
Dissolves bare copper to leave the circuit, with even etch across the whole panel.
Regeneration
Etchant Regeneration System
- FunctionRecycle etchant
- BenefitStable etch rate
Holds the etchant at constant concentration, steadying etch rate and cutting chemical cost.
Stripping
Stripping Machine
- ProcessResist strip
- Best forDry film / mask
Removes the dry-film resist or solder mask cleanly after etching.
Step 6 · Solder Mask & Legend
Solder mask, legend & cure
Coat the board with solder-mask ink, expose and develop it (reusing the exposure / developing line), print the legend marking, and bake to cure between wet steps.
Solder mask
Solder Mask Coating Machine
- CoatingSingle / double side
- InkPhoto-imageable
Applies solder-mask ink evenly across one or both sides of the board.
Silk screen
Silk Screen Printing Machine
- UseLegend / ink
- TypeFlatbed
Prints legend (silkscreen) marking and screen inks onto the panel.
Baking
Baking & Drying Oven
- TypeHot-air / IR
- UseCure / dry
Bakes and cures ink and dries panels between the wet process steps.
Step 7 · Surface Finish
HASL, OSP & ENIG
Finish the exposed copper pads so they stay solderable — choose hot-air solder leveling, organic OSP, or electroless nickel / immersion gold for fine-pitch and BGA.
HASL
Hot Air Solder Leveling (HASL)
- FinishHASL / lead-free
- UseSolderable pads
Coats the pads with solder and levels them flat with hot air knives.
OSP
OSP Surface Finish Line
- FinishOSP
- UseAnti-oxidation
Organic solderability preservative that keeps copper pads solderable and flat.
ENIG
ENIG Plating Machine
- FinishNi / Au (ENIG)
- UseFine-pitch / BGA
Electroless nickel + immersion gold for a flat, durable, wire-bondable finish.
Step 8 · Profiling, Cleaning & Test
Profile, clean, test & handle
Bring the board to final form — V-groove scoring for depaneling, a final clean, electrical test, and automatic loading / unloading to link the line.
V-groove
V-Grooving Cutting Machine
- FunctionV-cut scoring
- ModeAuto / manual
Cuts V-grooves so panels snap apart cleanly at depaneling.
Cleaning
Final PCB Cleaning Machine
- ProcessWash + dry
- StageFinal
Final wash and dry of the finished board before inspection and packing.
Testing
High-Speed Flying Probe Tester
- TestOpen / short
- TypeFlying probe
Fixtureless electrical test of opens and shorts — ideal for prototype and small batch.
Automation
Loading & Unloading Machine
- FunctionAuto load / unload
- UseLine automation
Automatic board loading and unloading to connect line stages and cut handling.