8-CCD Double-Side Exposure Machine
GE-8CCD600 8-CCD automatic-alignment solder-mask exposure machine — dual-side simultaneous exposure with ±12µm registration, for double-sided and multilayer high-end PCB.
Auto-aligned, dual-side exposure for high-end PCB
The GE-8CCD600 is a high-end 8-CCD automatic image-alignment solder-mask exposure machine for double-sided and multilayer boards. 8 freely-movable CCD cameras auto-detect the targets and dual UVW platforms align automatically to ±12µm, with dual-side simultaneous exposure — no misalignment. A UV-LED parallel surface light source gives even energy with 0–100% adjustable intensity and fast exposure (<10s, grade 9–12); intelligent temperature-controlled chilled-water cooling keeps energy stable. Far more accurate than pin/manual registration — ideal for fine-pitch, BGA and multilayer solder mask.
- ModelGE-8CCD600
- Light sourceUV-LED parallel surface light
- CCD cameras8, freely movable (target-switchable)
- AlignmentDual UVW platforms, ±12µm (±0.5mil)
- Field of view7 × 5 mm
- Exposure modeDual-side simultaneous
- Production size10×12in ~ 24×28in (film 26×30in)
- Board thickness0.1 – 3.5 mm (incl. copper)
- Solder maskGreen / black / white / blue / red
- Cooling / controlChilled water · touchscreen + PC
- Dimensions / weight2800×1740×2040mm / 1800kg
Registration you can trust
8-CCD auto alignment
8 freely-movable cameras + dual UVW platforms, ±12µm.
Dual-side simultaneous
Both sides exposed at once — high throughput, 2–3 boards/min.
UV-LED parallel light
Even energy, 0–100% intensity, fast exposure <10s.
Fine-pitch & BGA
For double-sided multilayer high-end boards.
Multi-color solder mask
Green, black, white, blue and red inks.
Chilled-water cooling
Intelligent temperature control, stable energy.
8-CCD exposure — common questions
8 CCD cameras auto-detect the targets and dual UVW platforms align automatically to ±12µm (±0.5mil), with a 7×5mm field of view. Built for double-sided and multilayer high-end PCB, especially fine-pitch and BGA boards.
8 freely-movable CCDs plus dual UVW platforms align automatically and can learn/verify registration — an order of magnitude more accurate than pin/manual registration, with no misalignment.
Green, black, white, blue and red photo-imageable solder mask; board thickness 0.1–3.5mm (incl. copper), production size 10×12in to 24×28in, throughput 2–3 boards/min.
The GE-LED700 is a UV-LED parallel-light circuit + solder-mask integrated machine — cost-effective, for small-to-mid volume. The GE-8CCD600 adds 8-CCD automatic alignment and dual-side simultaneous exposure at ±12µm, for double-sided multilayer, fine-pitch and BGA high-end boards.