GE-S400S Small Film Stripping Machine
Compact double-side spray stripping for PCB photoresist and solder mask removal — 400 × 500 mm working size, high-temperature chemical processing, water rinse. Designed for R&D labs, prototyping and small-batch PCB production.
GE-S400S Small Film Stripping Machine
The GE-S400S is the compact, high-temperature double-side spray stripping machine for PCB lab and small-batch production. The Load → Stripping → Running water rinse → Unload process removes dry-film and liquid photoresist cleanly, without damaging the underlying copper or dielectric.
- Working size400 × 500 mm
- ProcessStrip + rinse
- Best forR&D · prototype · small batch
GE-S400S — full specifications
| Parameter | Value |
|---|---|
| Model | GE-S400S |
| Working size (W) | 400 mm |
| Stripping area length | 500 mm |
| Process | Loading → Stripping → Running water rinse → Unloading |
| Stripping | Double-side spray, high-temperature chemical |
| Compatible resists | Dry-film photoresist, liquid photoresist, dry-film solder mask, liquid solder mask |
| Chemistry | 3-5% NaOH (or KOH for solder mask) |
| Temperature | 50 – 60 °C (45 – 50 °C for FPC) |
| Stripping time per panel | 60 – 90 s (resist) / 90 – 180 s (solder mask) |
| Conveyor speed | 0.5 – 2 m/min |
| Rinse | Running water (city or DI) |
| Best for | R&D · prototype · small batch PCB |
Where the GE-S400S sits in your line
The GE-S400S sits in Step 5 · Etching & Stripping of the PCB line — right after the etching machine, before solder mask coating. The full sequence:
- Board cutting & CNC drilling
- Brushing & pre-treatment (GE-MB650 / GE-B650 / GE-GB650)
- PTH & copper plating
- Exposure & developing
- Etching — leaves bare copper pattern with photoresist on
- GE-S400S Stripping Machine (this page) — removes the photoresist, leaving the bare copper pattern
- Solder mask coating
- HASL / OSP / ENIG finish
Related machines in the PCB line
GE-S400S FAQ
The GE-S400S is a compact double-side spray stripping machine for PCB photoresist and solder mask removal. Working size 400 × 500 mm, designed for R&D labs, prototyping and small-batch PCB production. The process is Load → Stripping → Running water rinse → Unload, with high-temperature chemical processing that removes the photoresist cleanly without damaging the underlying copper circuit.
The GE-S400S strips dry-film photoresist, liquid photoresist, dry-film solder mask, and liquid solder mask. It is compatible with all common aqueous resists and can be configured for either PCB photoresist removal (post-etching) or solder mask removal (post-ENIG / HASL). The high-temperature chemical bath and double-side spray action clear the resist without damaging the underlying copper or dielectric.
The GE-S400S uses a sodium hydroxide (NaOH) solution, typically 3-5% by weight, at 50-60 °C. For solder mask stripping, a higher-temperature NaOH or KOH-based chemistry may be used. The chemistry is contained in a sealed PP / PVC tank, heated with a titanium immersion heater, and continuously filtered to remove stripped resist particles.
The GE-S400S has a 400 mm wide stripping area, with a stripping length of 500 mm. This is sized for R&D panels and small-batch PCB production, typically up to 400 × 500 mm per panel. For larger panels, see the GE-650 double-side spray stripping line on our PCB equipment page.
Yes. The GE-S400S has a built-in running water rinse station after the stripping bath. The rinse is fed with city water (or DI water for cleaner results) and removes residual NaOH from the panel before unloading. The rinsed panel exits clean and dry-ready for the next step (HASL, ENIG, OSP, or final inspection).
Yes — the GE-S400S is suitable for flexible PCB and thin polyimide stripping. The double-side spray action is gentle on thin materials (down to 0.05 mm), and the temperature control is precise enough to avoid warping the flex substrate. For very thin FPC, run the conveyor at the lower end of the speed range (0.5-1.5 m/min) and reduce the strip bath temperature to 45-50 °C.
The GE-S400S is a compact lab / small-batch stripping machine (400 × 500 mm, 12 kW equivalent). The GE-MB650 is a full PCB cleaning / brushing machine used upstream of the etching step. The two are complementary — the GE-MB650 brushes the panel before etching, the GE-S400S strips the resist after etching.
Typical stripping time is 60-90 seconds per panel at 50-60 °C, depending on the resist type and thickness. Dry-film photoresist strips faster (45-60 seconds) than dry-film solder mask (90-180 seconds). The GE-S400S conveyor speed is typically 0.5-2 m/min, giving 1-2 panels per minute through the machine.