Work width: 650mm; Work thickness: Max 3mm
Process:Enter → Cycle DI washing → DI washing → Bleach washing → DI washing → Drying → Exit.

Working size: 650*L
Process: Enter → Acid washing → Overflow washing1→ DI washing → Hot water washing → Overflow washing 2→ DI washing → blow dry → Hot air dry → Exit

·TCO Glass washing line

Work width: 650mm; Work thickness: 0.1-3mm
Process: Enter → Degreasing → Hot water washing → Brushing washing → Pressure water washing → DI washing → blot dry → blow dry → Hot air dry → Exit

·LCD Washing line

Work Size: 2 to 8inch
Process: Enter → Ultrasonic washing → Hot DI washing → DI washing → blow dry → Hot air dry → Exit

·Silicon chip Etching line

Work width: 650mm; Work thickness: 0.1-3mm; Tolerance: ±2mil;
Process: Developing → Water washing → blot dry → Checking → Etching → washing → blot dry → Checking → Stripping → washing → blot dry